[1] 章睿. 废弃电子产品是一座“富矿”[J]. 上海企业, 2020(7): 40-41.
[2] 王建明. 废弃电器电子产品回收利用行业发展研究[J]. 中国科技信息, 2009(17): 3.
[3] 周艺, 秋凯. 一项从废弃印刷电路板回收材料的新技术[J]. 危险材料, 2010(1): 823-828.
[4] 周蕾, 许振明. 我国电子废弃物回收工艺研究进展[J]. 材料导报, 2012, 26(13): 155-160. doi: 10.3969/j.issn.1005-023X.2012.13.031
[5] 李桂春, 苑仁财. 废印刷电路板机械回收及湿法冶金技术研究现状[J]. 湿法冶金, 2011, 30(4): 272-275. doi: 10.3969/j.issn.1009-2617.2011.04.003
[6] 李勇, 付国燕, 丁剑, 等. 国内废线路板无害化处置现状及技术进展[J]. 有色冶金节能, 2020, 36(5): 7-948.
[7] 罗志华. 火法冶金工艺处理电子线路板并富集贵稀金属的试验研究[D]. 同济大学, 2007.
[8] OISHI T, KOYAMA K, ALAM S, et al. Recovery of high purity copper cathode from printed circuit boards using ammoniacal sulfate or chloride solutions[J]. Hydrometallurgy, 2007, 89(1/2): 82-88.
[9] 刘维平, 邱定蕃, 卢惠民. 湿法冶金新技术进展[J]. 矿冶工程, 2003(5): 39-42. doi: 10.3969/j.issn.0253-6099.2003.05.014
[10] 王成彦, 邱定蕃, 江培海. 国内锑冶金技术现状及进展[J]. 有色金属(冶炼部分), 2002(5): 6-10.
[11] 李非凡, 陈梦君, 王蓉. 矿浆电解法废弃CPU插槽的资源化回收[J]. 工业安全与环保, 2018, 44(10): 93-97. doi: 10.3969/j.issn.1001-425X.2018.10.024
[12] WANG J Q, HUANG Z M, YANG D Z, et al. A semi-scaled experiment for metals separating and recovering from waste printed circuit boards by slurry electrolysis[J]. Process Safety and Environmental Protection, 2021, 147: 37-44. doi: 10.1016/j.psep.2020.09.030
[13] 杨德泽. 矿浆电解从WPCBs中回收金属的实验室放大工艺研究[D]. 西南科技大学, 2019.
[14] YI X X, QI Y P, LI F F, et al. Effect of electrolyte reuse on metal recovery from waste CPU slots by slurry electrolysis[J]. Waste Management, 2019, 95: 370-376. doi: 10.1016/j.wasman.2019.06.034
[15] WANG J Q, CHEN S Y, ZENG X F, et al. Recovery of high purity copper from waste printed circuit boards of mobile phones by slurry electrolysis with ammonia-ammonium system[J]. Separation and Purification Technology, 2021, 275: 119180. doi: 10.1016/j.seppur.2021.119180
[16] CHEN Y M, LIU N N, HU F, et al. Thermal treatment and ammoniacal leaching for the recovery of valuable metals from spent lithium-ion batteries[J]. Waste Management, 2018, 75: 469-476. doi: 10.1016/j.wasman.2018.02.024
[17] 陈梦君, 陈姝媛, 王蓉, 等. 一种从废旧印刷线路板中回收铜的方法: CN112921356A[P]. 2021-06-08.
[18] Li F F, Chen M J, Shu J C, et al. Copper and gold recovery from CPU sockets by one-step slurry electrolysis[J]. Journal of Cleaner Production, 2019, 213(10): 673-679.
[19] 李霞, 叶红齐, 张丽艳, 等. EDTA分光光度法测定铜金粉中的高含量铜[J]. 粉末冶金材料科学与工程, 2008, 13(6): 373-376. doi: 10.3969/j.issn.1673-0224.2008.06.012
[20] XING P, MA B Z, WANG C Y, et al. A simple and effective process for recycling zinc-rich paint residue[J]. Waste Management, 2018, 76: 234-241. doi: 10.1016/j.wasman.2018.03.018
[21] QI Y P, MENG F S, YI X X, et al. A novel and efficient ammonia leaching method for recycling waste lithium ion batteries[J]. Journal of Cleaner Production, 2020, 251: 119665. doi: 10.1016/j.jclepro.2019.119665
[22] YASHNIK S A, ISMAGILOV Z R. The ammonia storage and ammonia species reactivity within Cu-ZSM-5 with different copper electronic states[J]. Applied Catalysis A:General, 2021, 615: 118054. doi: 10.1016/j.apcata.2021.118054
[23] JIN W. Effective treatment for electronic waste - Selective recovery of copper by combining electrochemical dissolution and deposition[J]. Journal of Cleaner Production, 2017, 152: 150-156. doi: 10.1016/j.jclepro.2017.03.112
[24] KANG Y H, CHEN S, WANG Q, et al. Solvation effect of Cl/AlCl3 ionic liquid electrolyte[J]. Ionics, 2018, 25(1): 163-169.
[25] LI J, DUAN C H, YUAN L G, et al. Recycling Spent Lead-Acid Batteries into Lead Halide for Resource Purification and Multifunctional Perovskite Diodes[J]. Environmental Science and Technology, 2021, 55: 8309-8317. doi: 10.1021/acs.est.1c01116
[26] 张晋霞, 冯洪均, 王龙, 等. 含锌冶金尘泥氨浸溶蚀实验研究[J]. 矿产综合利用, 2021(1): 124-129. doi: 10.3969/j.issn.1000-6532.2021.01.021
[27] YEH H W, TANG Y H, CHEN P Y. Electrochemical study and extraction of Pb metal from Pb oxides and Pb sulfate using hydrophobic Brønsted acidic amide-type ionic liquid: A feasibility demonstration[J]. Journal of Electroanalytical Chemistry, 2018, 811: 68-77. doi: 10.1016/j.jelechem.2018.01.031
[28] VICTOR Y Z, SNEJANA B. Microstructural analysis of undoped and moderately Sc-doped TiO2 anatase nanoparticles using Scherrer equation and Debye function analysis[J]. Materials Characterization, 2018, 144: 287-296. doi: 10.1016/j.matchar.2018.07.022
[29] WOO T G, Park I S, Park E K, et al. Effect of additives on the physical properties and surface morphology of copper foil[J]. Journal of Korean Institute of Metal and Materials, 2009, 47(9): 586-590.
[30] YI G B, CAI F M, PENG W Y, et al. Experimental analysis of pinholes on electrolytic copper foil and their prevention[J]. Engineering Failure Analysis, 2012, 23: 76-81. doi: 10.1016/j.engfailanal.2012.02.007
[31] 韩国强, 秦丽娟, 孙宁磊, 等. 双面光极薄电解铜箔制备及其微观组织与性能研究[J]. 中国有色冶金, 2021, 50(4): 13-18.